According to sources close to Reuters, China has developed a working prototype of an EUV machine, which is currently undergoing testing. This domestic achievement involved Chinese companies successfully reverse-engineering ASML's EUV lithography scanners and creating a functional version using second-hand components. The new EUV prototype reportedly takes up an entire factory floor, comparable in size to modern High-NA EUV machines from ASML. Chinese companies are said to have obtained parts from older ASML machines on secondary markets. The Chinese government initially set a goal of producing working chips from the prototype by 2028.

weak shit, smh give me some novel free electron laser shit, mrx chinese

In early 2025, we reported that a new EUV machine was undergoing testing at Huawei's Dongguan facility. This machine leverages laser-induced discharge plasma (LDP) technology, representing a potentially disruptive approach to EUV light generation. The LDP approach used in the Chinese system generates 13.5 nm EUV radiation by vaporizing tin between electrodes and converting it to plasma through high-voltage discharge, where electron-ion collisions produce the required wavelength. This methodology offers several technical advantages over ASML's laser-produced plasma (LPP) technique, including a simplified architecture, reduced footprint, improved energy efficiency, and potentially lower production costs.

although tpu suggest they are not doing full reverse engineering, but what on earth could take that much space with different light emission mechanism, they don't need tin inkjet printers